In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu<sub>6</sub>Sn<sub>5</sub> Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage
Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was cha...
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| Principais autores: | , , , , |
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| 格式: | Artigo |
| 語言: | Inglês |
| 出版: |
MDPI AG
2023-08-01
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| 叢編: | Metals |
| 主題: | |
| 在線閱讀: | https://www.mdpi.com/2075-4701/13/8/1445 |
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