Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders
The corrosion resistance of solder joints is a critical factor affecting the service life of electronic products during long-term operation. In this study, the corrosion behavior of Sn-0.7Cu-<i>x</i>Ni@C (<i>x</i> = 0, 0.04, 0.08, and 0.12 wt.%) composite solders was investigated using a Tafel polar...
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| Autori principali: | , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI AG
2022-07-01
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| Serie: | Metals |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2075-4701/12/7/1172 |
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