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Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

The corrosion resistance of solder joints is a critical factor affecting the service life of electronic products during long-term operation. In this study, the corrosion behavior of Sn-0.7Cu-<i>x</i>Ni@C (<i>x</i> = 0, 0.04, 0.08, and 0.12 wt.%) composite solders was investigated using a Tafel polar...

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Bibliografiska uppgifter
Huvudupphov: Guoge Lu, Bo Lin, Zhan Gao, Yingxin Li, Fuxiang Wei
Materialtyp: Artigo
Språk:Inglês
Utgiven: MDPI AG 2022-07-01
Serie:Metals
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Länkar:https://www.mdpi.com/2075-4701/12/7/1172
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