Thermal Deformation Behavior and Interface Microstructure Analysis of 2205/Q345 Hot Compression Composite
The high-temperature thermal deformation behavior of a 2205/Q345 specimen at 850–1100 °C and strain rate of 0.01–10 s<sup>−1</sup> was systematically studied by the Gleeble-3800 thermal simulator, which provided a theoretical basis for the optimization of a 2205 duplex stainless steel composite plat...
I tiakina i:
| Ngā kaituhi matua: | , , , , |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
MDPI AG
2022-02-01
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| Rangatū: | Crystals |
| Ngā marau: | |
| Urunga tuihono: | https://www.mdpi.com/2073-4352/12/2/301 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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