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Thermal Deformation Behavior and Interface Microstructure Analysis of 2205/Q345 Hot Compression Composite

The high-temperature thermal deformation behavior of a 2205/Q345 specimen at 850–1100 °C and strain rate of 0.01–10 s<sup>−1</sup> was systematically studied by the Gleeble-3800 thermal simulator, which provided a theoretical basis for the optimization of a 2205 duplex stainless steel composite plat...

Deskribapen osoa

Gorde:
Xehetasun bibliografikoak
Egile Nagusiak: Xiaoyang Wang, Pengtao Liu, Guanghui Zhao, Juan Li, Chenchen Zhi
Formatua: Artigo
Hizkuntza:Inglês
Argitaratua: MDPI AG 2022-02-01
Saila:Crystals
Gaiak:
Sarrera elektronikoa:https://www.mdpi.com/2073-4352/12/2/301
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