Thermal Deformation Behavior and Interface Microstructure Analysis of 2205/Q345 Hot Compression Composite
The high-temperature thermal deformation behavior of a 2205/Q345 specimen at 850–1100 °C and strain rate of 0.01–10 s<sup>−1</sup> was systematically studied by the Gleeble-3800 thermal simulator, which provided a theoretical basis for the optimization of a 2205 duplex stainless steel composite plat...
Guardado en:
| Autores principales: | , , , , |
|---|---|
| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI AG
2022-02-01
|
| Colección: | Crystals |
| Materias: | |
| Acceso en línea: | https://www.mdpi.com/2073-4352/12/2/301 |
| Etiquetas: |
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
