Effect of chip temperature during bonding on particleboard properties
In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and aff...
Wedi'i Gadw mewn:
| Cyhoeddwyd yn: | Maderas. Ciencia y Tecnología |
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| Prif Awduron: | , , |
| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
Universidad del Bío Bío
2023
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| Pynciau: | |
| Mynediad Ar-lein: | https://www.redalyc.org/articulo.oa?id=48575202017 https://www.redalyc.org/journal/485/48575202017/ https://www.redalyc.org/journal/485/48575202017/html/ https://www.redalyc.org/journal/485/48575202017/48575202017.epub https://www.redalyc.org/journal/485/48575202017/movil |
| Tagiau: |
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