Učitavanje...
Effect of chip temperature during bonding on particleboard properties
In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and aff...
Spremljeno u:
| Izdano u: | Maderas. Ciencia y Tecnología |
|---|---|
| Glavni autori: | , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Universidad del Bío Bío
2023
|
| Teme: | |
| Online pristup: | https://www.redalyc.org/articulo.oa?id=48575202017 |
| Oznake: |
Dodaj oznaku
Bez oznaka, Budi prvi tko označuje ovaj zapis!
|