Effect of chip temperature during bonding on particleboard properties
In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and aff...
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| Yayımlandı: | Maderas. Ciencia y Tecnología |
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| Asıl Yazarlar: | , , |
| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Universidad del Bío Bío
2023
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| Konular: | |
| Online Erişim: | https://www.redalyc.org/articulo.oa?id=48575202017 https://www.redalyc.org/journal/485/48575202017/ https://www.redalyc.org/journal/485/48575202017/html/ https://www.redalyc.org/journal/485/48575202017/48575202017.epub https://www.redalyc.org/journal/485/48575202017/movil |
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