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Total Recovery of Gold Contained in Computer Printed Circuit Boards. Leaching Kinetics of Cu, Zn and Ni

In this study a thorough characterization of certain printed circuit boards has been carried out; it was found that they are made up of a polymer layer, a metal layer of Cu, Zn and Ni, and a gold substrate. A kinetic study of the acid dynamic leaching of copper, zinc and nickel has been carried out...

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Bibliografische gegevens
Gepubliceerd in:Journal of the Mexican Chemical Society
Hoofdauteurs: María Isabel Reyes, Isauro Rivera, Francisco Patiño, Mizraim U. Flores, Martín Reyes
Formaat: Artigo
Taal:Inglês
Gepubliceerd in: Sociedad Química de México 2012
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Online toegang:https://www.redalyc.org/articulo.oa?id=47523306010
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