Total Recovery of Gold Contained in Computer Printed Circuit Boards. Leaching Kinetics of Cu, Zn and Ni
In this study a thorough characterization of certain printed circuit boards has been carried out; it was found that they are made up of a polymer layer, a metal layer of Cu, Zn and Ni, and a gold substrate. A kinetic study of the acid dynamic leaching of copper, zinc and nickel has been carried out...
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| Publicado no: | Journal of the Mexican Chemical Society |
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| Principais autores: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Sociedad Química de México
2012
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| Assuntos: | |
| Acesso em linha: | https://www.redalyc.org/articulo.oa?id=47523306010 |
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