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Electrical Interconnection and Bonding by Nano-Locking
The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with th...
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| Publicado no: | Nanomaterials (Basel) |
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| Main Authors: | , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2021
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC8233979/ https://ncbi.nlm.nih.gov/pubmed/34204330 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/nano11061589 |
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