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A RF Redundant TSV Interconnection for High Resistance Si Interposer
Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio fre...
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| 出版年: | Micromachines (Basel) |
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| 主要な著者: | , , , , , , |
| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI
2021
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| 主題: | |
| オンライン･アクセス: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7914721/ https://ncbi.nlm.nih.gov/pubmed/33567782 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi12020169 |
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