Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a l...

Disgrifiad llawn

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Cyhoeddwyd yn:Microsyst Nanoeng
Prif Awduron: Khorramdel, Behnam, Liljeholm, Jessica, Laurila, Mika-Matti, Lammi, Toni, Mårtensson, Gustaf, Ebefors, Thorbjörn, Niklaus, Frank, Mäntysalo, Matti
Fformat: Artigo
Iaith:Inglês
Cyhoeddwyd: Nature Publishing Group 2017
Pynciau:
Article
Mynediad Ar-lein:https://ncbi.nlm.nih.gov/pmc/articles/PMC6445024/
https://ncbi.nlm.nih.gov/pubmed/31057857
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/micronano.2017.2
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