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Inkjet printing technology for increasing the I/O density of 3D TSV interposers
Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a l...
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| Izdano u: | Microsyst Nanoeng |
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| Glavni autori: | , , , , , , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Nature Publishing Group
2017
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| Teme: | |
| Online pristup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6445024/ https://ncbi.nlm.nih.gov/pubmed/31057857 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/micronano.2017.2 |
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