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Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating
Here, in a certain high density interconnect (HDI) printed circuit board, the effect of copper sulfate and sulfuric acid on the filling effect of a blind hole with a certain diameter and depth was investigated by making a blind hole using a CO(2) laser drilling machine, filling the blind hole via el...
Gorde:
| Argitaratua izan da: | Materials (Basel) |
|---|---|
| Egile Nagusiak: | , , , |
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
MDPI
2020
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| Gaiak: | |
| Sarrera elektronikoa: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7796361/ https://ncbi.nlm.nih.gov/pubmed/33375391 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma14010085 |
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