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Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating
Here, in a certain high density interconnect (HDI) printed circuit board, the effect of copper sulfate and sulfuric acid on the filling effect of a blind hole with a certain diameter and depth was investigated by making a blind hole using a CO(2) laser drilling machine, filling the blind hole via el...
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| 出版年: | Materials (Basel) |
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| 主要な著者: | , , , |
| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI
2020
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| 主題: | |
| オンライン･アクセス: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7796361/ https://ncbi.nlm.nih.gov/pubmed/33375391 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma14010085 |
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