טוען...
The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer
Double-sides polishing technology has the advantages of high flatness and parallelism, and high polishing efficiency. It is the preferred polishing method for the preparation of ultra-thin sapphire wafer. However, the clamping method is a fundamental problem which is currently difficult to solve. In...
שמור ב:
| הוצא לאור ב: | Micromachines (Basel) |
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| Main Authors: | , , , , , |
| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
MDPI
2020
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| נושאים: | |
| גישה מקוונת: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7464148/ https://ncbi.nlm.nih.gov/pubmed/32781686 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi11080759 |
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