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Recent Advances on Thermal Management of Flexible Inorganic Electronics

Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissip...

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Detalhes bibliográficos
Publicado no:Micromachines (Basel)
Main Authors: Li, Yuhang, Chen, Jiayun, Zhao, Shuang, Song, Jizhou
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI 2020
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC7231351/
https://ncbi.nlm.nih.gov/pubmed/32283609
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi11040390
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