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Recent Advances on Thermal Management of Flexible Inorganic Electronics
Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissip...
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| Publicado en: | Micromachines (Basel) |
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| Autores principales: | , , , |
| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7231351/ https://ncbi.nlm.nih.gov/pubmed/32283609 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi11040390 |
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