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Microstructure Influence of SACX0307-TiO(2) Composite Solder Joints on Thermal Properties of Power LED Assemblies
The effect of the microstructure of solder joints on the thermal properties of power LEDs is investigated. Solder joints were prepared with different solder pastes, namely 99Sn0.3Ag0.7Cu (as reference solder) and reinforced 99Sn0.3Ag0.7Cu–TiO(2) (composite solder). TiO(2) ceramic was used at 1 wt.%...
Tallennettuna:
| Julkaisussa: | Materials (Basel) |
|---|---|
| Päätekijät: | , , , , |
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
MDPI
2020
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| Aiheet: | |
| Linkit: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7177409/ https://ncbi.nlm.nih.gov/pubmed/32231058 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma13071563 |
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