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A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology
A miniature piezoresistive pressure sensor fabricated by temporary bonding technology was reported in this paper. The sensing membrane was formed on the device layer of an SOI (Silicon-On-Insulator) wafer, which was bonded to borosilicate glass (Borofloat 33, BF33) wafer for supporting before releas...
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| Publicado en: | Sensors (Basel) |
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| Autores principales: | , , , , , , |
| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7013386/ https://ncbi.nlm.nih.gov/pubmed/31936069 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s20020337 |
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