Caricamento...
A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology
A miniature piezoresistive pressure sensor fabricated by temporary bonding technology was reported in this paper. The sensing membrane was formed on the device layer of an SOI (Silicon-On-Insulator) wafer, which was bonded to borosilicate glass (Borofloat 33, BF33) wafer for supporting before releas...
Salvato in:
| Pubblicato in: | Sensors (Basel) |
|---|---|
| Autori principali: | , , , , , , |
| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI
2020
|
| Soggetti: | |
| Accesso online: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7013386/ https://ncbi.nlm.nih.gov/pubmed/31936069 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s20020337 |
| Tags: |
Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne! !
|