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Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric...

Täydet tiedot

Tallennettuna:
Bibliografiset tiedot
Julkaisussa:Nanomaterials (Basel)
Päätekijät: Xie, Shuping, Wan, Xinjun, Yang, Bo, Zhang, Wei, Wei, Xiaoxiao, Zhuang, Songlin
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: MDPI 2019
Aiheet:
Linkit:https://ncbi.nlm.nih.gov/pmc/articles/PMC6567065/
https://ncbi.nlm.nih.gov/pubmed/31096627
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/nano9050747
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