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Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric...

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Detalhes bibliográficos
Publicado no:Nanomaterials (Basel)
Main Authors: Xie, Shuping, Wan, Xinjun, Yang, Bo, Zhang, Wei, Wei, Xiaoxiao, Zhuang, Songlin
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI 2019
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC6567065/
https://ncbi.nlm.nih.gov/pubmed/31096627
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/nano9050747
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