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Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature
Electromigration was characterized at the cathode Cu/solder interface—without the effect of Joule heating—by employing scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) analyses. Rapid (Cu(x),Ni(1−x))(6)Sn(5) intermetallic compound (IMC) growth was observed at the anomal...
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| Publicado no: | Materials (Basel) |
|---|---|
| Main Authors: | , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2019
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6566418/ https://ncbi.nlm.nih.gov/pubmed/31096663 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma12101593 |
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