Wordt geladen...
Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In an effort to improve IMC based interconnects, an...
Bewaard in:
| Gepubliceerd in: | Materials (Basel) |
|---|---|
| Hoofdauteurs: | , , |
| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
MDPI
2016
|
| Onderwerpen: | |
| Online toegang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5456830/ https://ncbi.nlm.nih.gov/pubmed/28773552 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma9060430 |
| Tags: |
Voeg label toe
Geen labels, Wees de eerste die dit record labelt!
|