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Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding
High-precision aligned wafer bonding is essential to heterogeneous integration, with the device dimension reduced continuously. To get the alignment more accurately and conveniently, we propose a moiré-based alignment method using centrosymmetric grating marks. This method enables both coarse and fi...
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| Publicado no: | Micromachines (Basel) |
|---|---|
| Main Authors: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2019
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6563106/ https://ncbi.nlm.nih.gov/pubmed/31121955 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10050339 |
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