Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Relatively low mobility and thermal conductance create challenges for application of tungsten diselenide (WSe(2)) in high performance devices. Dielectric interface is of extremely importance for improving carrier transport and heat spreading in a semiconductor device. Here, by near-equilibrium plasm...

Cijeli opis

Spremljeno u:
Bibliografski detalji
Izdano u:Nat Commun
Glavni autori: Liu, Donghua, Chen, Xiaosong, Yan, Yaping, Zhang, Zhongwei, Jin, Zhepeng, Yi, Kongyang, Zhang, Cong, Zheng, Yujie, Wang, Yao, Yang, Jun, Xu, Xiangfan, Chen, Jie, Lu, Yunhao, Wei, Dapeng, Wee, Andrew Thye Shen, Wei, Dacheng
Format: Artigo
Jezik:Inglês
Izdano: Nature Publishing Group UK 2019
Teme:
Article
Online pristup:https://ncbi.nlm.nih.gov/pmc/articles/PMC6416324/
https://ncbi.nlm.nih.gov/pubmed/30867418
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41467-019-09016-0
Oznake: Dodaj oznaku
Bez oznaka, Budi prvi tko označuje ovaj zapis!

Similar Items