Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Relatively low mobility and thermal conductance create challenges for application of tungsten diselenide (WSe(2)) in high performance devices. Dielectric interface is of extremely importance for improving carrier transport and heat spreading in a semiconductor device. Here, by near-equilibrium plasm...

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Publicado no:Nat Commun
Main Authors: Liu, Donghua, Chen, Xiaosong, Yan, Yaping, Zhang, Zhongwei, Jin, Zhepeng, Yi, Kongyang, Zhang, Cong, Zheng, Yujie, Wang, Yao, Yang, Jun, Xu, Xiangfan, Chen, Jie, Lu, Yunhao, Wei, Dapeng, Wee, Andrew Thye Shen, Wei, Dacheng
Formato: Artigo
Idioma:Inglês
Publicado em: Nature Publishing Group UK 2019
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Article
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC6416324/
https://ncbi.nlm.nih.gov/pubmed/30867418
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41467-019-09016-0
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