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Fabrication and Characteristics of SnAgCu Alloy Nanowires for Electrical Connection Application
As electronic products become more functional, the devices are required to provide better performances and meet ever smaller form factor requirements. To achieve a higher I/O density within the smallest form factor package, applying nanotechniques to electronic packaging can be regarded as a possibl...
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| Publicado no: | Micromachines (Basel) |
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| Main Authors: | , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2018
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6316273/ https://ncbi.nlm.nih.gov/pubmed/30563062 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9120644 |
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