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Fabrication and Characteristics of SnAgCu Alloy Nanowires for Electrical Connection Application

As electronic products become more functional, the devices are required to provide better performances and meet ever smaller form factor requirements. To achieve a higher I/O density within the smallest form factor package, applying nanotechniques to electronic packaging can be regarded as a possibl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Micromachines (Basel)
Hauptverfasser: Chen, Jung-Hsuan, Lo, Shen-Chuan, Hsu, Shu-Chi, Hsu, Chun-Yao
Format: Artigo
Sprache:Inglês
Veröffentlicht: MDPI 2018
Schlagworte:
Online Zugang:https://ncbi.nlm.nih.gov/pmc/articles/PMC6316273/
https://ncbi.nlm.nih.gov/pubmed/30563062
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9120644
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