A carregar...
Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ablation was developed and analyzed. The experim...
Na minha lista:
| Publicado no: | Micromachines (Basel) |
|---|---|
| Main Authors: | , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2018
|
| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6187369/ https://ncbi.nlm.nih.gov/pubmed/30424072 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9030138 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|