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Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ablation was developed and analyzed. The experim...
Tallennettuna:
| Julkaisussa: | Micromachines (Basel) |
|---|---|
| Päätekijät: | , , |
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
MDPI
2018
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| Aiheet: | |
| Linkit: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6187369/ https://ncbi.nlm.nih.gov/pubmed/30424072 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9030138 |
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