Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to...

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Αποθηκεύτηκε σε:
Λεπτομέρειες βιβλιογραφικής εγγραφής
Τόπος έκδοσης:ACS Nano
Κύριοι συγγραφείς: Kim, Bong Hoon, Lee, Jungyup, Won, Sang Min, Xie, Zhaoqian, Chang, Jan-Kai, Yu, Yongjoon, Cho, Youn Kyoung, Jang, Hokyung, Jeong, Ji Yoon, Lee, Yechan, Ryu, Arin, Kim, Do Hoon, Lee, Kun Hyuck, Lee, Jong Yoon, Liu, Fei, Wang, Xueju, Huo, Qingze, Min, Seunghwan, Wu, Di, Ji, Bowen, Banks, Anthony, Kim, Jeonghyun, Oh, Nuri, Jin, Hyeong Min, Han, Seungyong, Kang, Daeshik, Lee, Chi Hwan, Song, Young Min, Zhang, Yihui, Huang, Yonggang, Jang, Kyung-In, Rogers, John A.
Μορφή: Artigo
Γλώσσα:Inglês
Έκδοση: 2018
Θέματα:
Article
Διαθέσιμο Online:https://ncbi.nlm.nih.gov/pmc/articles/PMC5986289/
https://ncbi.nlm.nih.gov/pubmed/29641889
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsnano.8b00180
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