Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to...

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Detalhes bibliográficos
Publicado no:ACS Nano
Main Authors: Kim, Bong Hoon, Lee, Jungyup, Won, Sang Min, Xie, Zhaoqian, Chang, Jan-Kai, Yu, Yongjoon, Cho, Youn Kyoung, Jang, Hokyung, Jeong, Ji Yoon, Lee, Yechan, Ryu, Arin, Kim, Do Hoon, Lee, Kun Hyuck, Lee, Jong Yoon, Liu, Fei, Wang, Xueju, Huo, Qingze, Min, Seunghwan, Wu, Di, Ji, Bowen, Banks, Anthony, Kim, Jeonghyun, Oh, Nuri, Jin, Hyeong Min, Han, Seungyong, Kang, Daeshik, Lee, Chi Hwan, Song, Young Min, Zhang, Yihui, Huang, Yonggang, Jang, Kyung-In, Rogers, John A.
Formato: Artigo
Idioma:Inglês
Publicado em: 2018
Assuntos:
Article
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC5986289/
https://ncbi.nlm.nih.gov/pubmed/29641889
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsnano.8b00180
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