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Subsurface Damage in Polishing Process of Silicon Carbide Ceramic
Subsurface damage (SSD) in the polishing process of silicon carbide (SiC) ceramic presents one of the most significant challenges for practical applications. In this study, the theoretical models of SSD depth are established on the basis of the material removal mechanism and indentation fracture mec...
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| Publié dans: | Materials (Basel) |
|---|---|
| Auteurs principaux: | , , , , |
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
MDPI
2018
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| Sujets: | |
| Accès en ligne: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5951352/ https://ncbi.nlm.nih.gov/pubmed/29584694 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma11040506 |
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