Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies

[Image: see text] Oxide and nitride thin-films of Ti, Hf, and Si serve numerous applications owing to the diverse range of their material properties. It is therefore imperative to have proper control over these properties during materials processing. Ion-surface interactions during plasma processing...

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Publicat a:ACS Appl Mater Interfaces
Autors principals: Faraz, Tahsin, Knoops, Harm C. M., Verheijen, Marcel A., van Helvoirt, Cristian A. A., Karwal, Saurabh, Sharma, Akhil, Beladiya, Vivek, Szeghalmi, Adriana, Hausmann, Dennis M., Henri, Jon, Creatore, Mariadriana, Kessels, Wilhelmus M. M.
Format: Artigo
Idioma:Inglês
Publicat: American Chemical Society 2018
Accés en línia:https://ncbi.nlm.nih.gov/pmc/articles/PMC5909180/
https://ncbi.nlm.nih.gov/pubmed/29554799
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsami.8b00183
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