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A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Microbumps in three-dimensional integrated circuit now becomes essential technology to reach higher packaging density. However, the small volume of microbumps dramatically changes the characteristics from the flip-chip (FC) solder joints. For a 20 µm diameter microbump, the cross-section area and th...
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| Publicado no: | Sci Rep |
|---|---|
| Main Authors: | , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group UK
2018
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5897565/ https://ncbi.nlm.nih.gov/pubmed/29651034 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-018-23809-1 |
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