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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D laminography imaging technique was employed for in-situ observation of the microstructure evolution during testing. We found that discrete voids nucleate, grow and coalesce along the intermetallic compound...
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| Publicado no: | Sci Rep |
|---|---|
| Main Authors: | , , , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group UK
2017
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5738397/ https://ncbi.nlm.nih.gov/pubmed/29263329 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-017-06250-8 |
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