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RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances

With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization. Although graphene-assisted epoxy resin (ER) display promising potential to enhance the thermal performances, some limitations of the reduced gr...

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Detaylı Bibliyografya
Yayımlandı:Nanoscale Res Lett
Asıl Yazarlar: Bo, Tang, Zhengwei, Wang, Huang, Weiqiu, Sen, Li, Tingting, Ma, Haogang, Yu, Xufei, Li
Materyal Türü: Artigo
Dil:Inglês
Baskı/Yayın Bilgisi: Springer US 2017
Konular:
Online Erişim:https://ncbi.nlm.nih.gov/pmc/articles/PMC5585116/
https://ncbi.nlm.nih.gov/pubmed/28875303
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/s11671-017-2298-z
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