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RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances
With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization. Although graphene-assisted epoxy resin (ER) display promising potential to enhance the thermal performances, some limitations of the reduced gr...
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| Publicado no: | Nanoscale Res Lett |
|---|---|
| Main Authors: | , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Springer US
2017
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5585116/ https://ncbi.nlm.nih.gov/pubmed/28875303 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/s11671-017-2298-z |
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