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Nanoscale x-ray imaging of circuit features without wafer etching
Modern integrated circuits (ICs) employ a myriad of materials organized at nanoscale dimensions, and certain critical tolerances must be met for them to function. To understand departures from intended functionality, it is essential to examine ICs as manufactured so as to adjust design rules, ideall...
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| Publicado no: | Phys Rev B |
|---|---|
| Main Authors: | , , , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
2017
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5525020/ https://ncbi.nlm.nih.gov/pubmed/28752135 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1103/PhysRevB.95.104111 |
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