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Thermal Conductivity of Diamond Composites
A major problem challenging specialists in present-day materials sciences is the development of compact, cheap to fabricate heat sinks for electronic devices, primarily for computer processors, semiconductor lasers, high-power microchips, and electronics components. The materials currently used for...
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| Pubblicato in: | Materials (Basel) |
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| Autori principali: | , |
| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Molecular Diversity Preservation International
2009
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| Soggetti: | |
| Accesso online: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5513588/ https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma2042467 |
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