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The Effect of Cu:Ag Atomic Ratio on the Properties of Sputtered Cu–Ag Alloy Thin Films

Cu–Ag thin films with various atomic ratios were prepared using a co-sputtering technique, followed by rapid thermal annealing at various temperatures. The films’ structural, mechanical, and electrical properties were then characterized using X-ray diffractometry (XRD), atomic force microscopy (AFM)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Veröffentlicht in:Materials (Basel)
Hauptverfasser: Hsieh, Janghsing, Hung, Shunyang
Format: Artigo
Sprache:Inglês
Veröffentlicht: MDPI 2016
Schlagworte:
Online Zugang:https://ncbi.nlm.nih.gov/pmc/articles/PMC5457197/
https://ncbi.nlm.nih.gov/pubmed/28774033
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma9110914
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