Načítá se...
Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported n...
Uloženo v:
| Vydáno v: | Materials (Basel) |
|---|---|
| Hlavní autoři: | , , , , |
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI
2016
|
| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5456888/ https://ncbi.nlm.nih.gov/pubmed/28773686 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma9070564 |
| Tagy: |
Přidat tag
Žádné tagy, Buďte první, kdo otaguje tento záznam!
|