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Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported n...
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| Izdano u: | Materials (Basel) |
|---|---|
| Glavni autori: | , , , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
MDPI
2016
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| Teme: | |
| Online pristup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5456888/ https://ncbi.nlm.nih.gov/pubmed/28773686 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma9070564 |
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