Загрузка...
Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported n...
Сохранить в:
| Опубликовано в: : | Materials (Basel) |
|---|---|
| Главные авторы: | , , , , |
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI
2016
|
| Предметы: | |
| Online-ссылка: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5456888/ https://ncbi.nlm.nih.gov/pubmed/28773686 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma9070564 |
| Метки: |
Добавить метку
Нет меток, Требуется 1-ая метка записи!
|