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Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer

Microstructure curvature, or buckling, is observed in the micromachining of silicon sensors because of the doping of impurities for realizing certain electrical and mechanical processes. This behavior can be a key source of error in inertial sensors. Therefore, identifying the factors that influence...

詳細記述

保存先:
書誌詳細
出版年:Materials (Basel)
主要な著者: Zhou, Wu, Yu, Huijun, Peng, Bei, Shen, Huaqin, He, Xiaoping, Su, Wei
フォーマット: Artigo
言語:Inglês
出版事項: MDPI 2013
主題:
オンライン・アクセス:https://ncbi.nlm.nih.gov/pmc/articles/PMC5452111/
https://ncbi.nlm.nih.gov/pubmed/28809305
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma6010244
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