Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are...

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Bibliographic Details
Published in:Sensors (Basel)
Main Authors: Zhang, Zhongkai, Tian, Bian, Yu, Qiuyue, Shi, Peng, Lin, Qijing, Zhao, Na, Jing, Weixuan, Jiang, Zhuangde
Format: Artigo
Language:Inglês
Published: MDPI 2017
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Article
Online Access:https://ncbi.nlm.nih.gov/pmc/articles/PMC5424734/
https://ncbi.nlm.nih.gov/pubmed/28420088
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s17040857
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