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High thermal conductivity in soft elastomers with elongated liquid metal inclusions
Soft dielectric materials typically exhibit poor heat transfer properties due to the dynamics of phonon transport, which constrain thermal conductivity (k) to decrease monotonically with decreasing elastic modulus (E). This thermal−mechanical trade-off is limiting for wearable computing, soft roboti...
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| Vydáno v: | Proc Natl Acad Sci U S A |
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| Hlavní autoři: | , , , , , , |
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
National Academy of Sciences
2017
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| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5338550/ https://ncbi.nlm.nih.gov/pubmed/28193902 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1073/pnas.1616377114 |
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