High thermal conductivity in soft elastomers with elongated liquid metal inclusions

Soft dielectric materials typically exhibit poor heat transfer properties due to the dynamics of phonon transport, which constrain thermal conductivity (k) to decrease monotonically with decreasing elastic modulus (E). This thermal−mechanical trade-off is limiting for wearable computing, soft roboti...

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Gorde:
Xehetasun bibliografikoak
Argitaratua izan da:Proc Natl Acad Sci U S A
Egile Nagusiak: Bartlett, Michael D., Kazem, Navid, Powell-Palm, Matthew J., Huang, Xiaonan, Sun, Wenhuan, Malen, Jonathan A., Majidi, Carmel
Formatua: Artigo
Hizkuntza:Inglês
Argitaratua: National Academy of Sciences 2017
Gaiak:
Physical Sciences
Sarrera elektronikoa:https://ncbi.nlm.nih.gov/pmc/articles/PMC5338550/
https://ncbi.nlm.nih.gov/pubmed/28193902
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1073/pnas.1616377114
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