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Sequential shape-and-solder-directed self-assembly of functional microsystems
We demonstrate the fabrication of packaged microsystems that contain active semiconductor devices and passive components by using a directed self-assembly technique. The directed self-assembly is accomplished by combining geometrical shape recognition with site-specific binding involving liquid sold...
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| Main Authors: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
National Academy of Sciences
2004
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC516478/ https://ncbi.nlm.nih.gov/pubmed/15317938 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1073/pnas.0404437101 |
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