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Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points
This communication presents fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The multilayer solder bump is a lead free ternary solder system, which provides a route to transform the melting point of interco...
Sparad:
| I publikationen: | Sci Rep |
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| Huvudupphovsmän: | , , , , , , |
| Materialtyp: | Artigo |
| Språk: | Inglês |
| Publicerad: |
Nature Publishing Group UK
2019
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| Ämnen: | |
| Länkar: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6683123/ https://ncbi.nlm.nih.gov/pubmed/31383873 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-019-47690-8 |
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