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Mechanical Strength and Broadband Transparency Improvement of Glass Wafers via Surface Nanostructures

In this study, we mechanically strengthened a borosilicate glass wafer by doubling its bending strength and simultaneously enhancing its transparency using surface nanostructures for different applications including sensors, displays and panels. A fabrication method that combines dry and wet etching...

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Détails bibliographiques
Publié dans:Sensors (Basel)
Auteurs principaux: Kumar, Amarendra, Kashyap, Kunal, Hou, Max T., Yeh, J. Andrew
Format: Artigo
Langue:Inglês
Publié: MDPI 2016
Sujets:
Accès en ligne:https://ncbi.nlm.nih.gov/pmc/articles/PMC4934328/
https://ncbi.nlm.nih.gov/pubmed/27322276
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s16060902
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